Boren Fellowships and Scholarships

Upcoming Workshops 

Wednesday, October 29: Informational Session | 12:30-1:30 p.m. 

Boren Undergraduate Scholarships

Deadline for undergraduate students: Sunday, January 25, 2015 

Boren Scholarships provide up to $20,000 to U.S. undergraduate students to study abroad in areas of the world critical to U.S. interests and underrepresented in study abroad, including Africa, Asia, Central and Eastern Europe, Eurasia, Latin America, and the Middle East. Boren Scholars are interested in studying less commonly taught languages such as Arabic, Chinese, Korean, Portuguese, Russian, and Swahili. The countries of Western Europe, Canada, Australia, and New Zealand are excluded. Students must fulfill a one-year federal service requirement within three years of graduation. For U.S. Students only. Applicants wishing to apply for the Boren Scholarship Program will work with Study Abroad to determine a suitable program, and work with Karen Wachsmuth on application submission.

Please consult the Boren Undergraduate Scholarships webpage for a complete list of application materials.

Boren Graduate Fellowships

Deadline for graduate students: Tuesday, January 27, 2015

Boren Fellowships provide up $30,000 to U.S. graduate students to add an important international and language component to their graduate education and specialization in area study, language study, or increased language proficiency. Boren Fellowships support study and research in areas of the world that are critical to U.S. interests, including Africa, Asia, Central and Eastern Europe, Eurasia, Latin America, and the Middle East. Boren Fellows are interested in studying less commonly taught languages such as Arabic, Chinese, Korean, Portuguese, Russian, and Swahili. The countries of Western Europe, Canada, Australia, and New Zealand are excluded. Students must fulfill a one-year federal service requirement within two years of graduation. For U.S. Students only.

Please consult the Boren Graduate Fellowships webpage for a complete list of application materials.